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HSMx-A46x-xxxxx
SMT LED Surface Mount LED Indicator
Data Sheet
Description
The Power PLCC-4 SMT LED with Lens are high performance PLCC-4 package size SMT LEDs targeted mainly in Automotive & Electronics Signs and Signals (ESS) markets. These top-mount single-chip packages with focused radiation offer high brightness in beam direction and are excellent for interior automotive, indoor and outdoor sign and industrial applications. With additional lens in 50 variants, these products are especially fitting to applications for Mono-color Text Display, CHMSL and displays. The PLCC-4 package family is able to dissipate heat better compared to the PLCC-2 packages. In proportion to this increase in driving current, this family of LEDs is able to produce higher light output compared to the conventional PLCC-2 SMT LEDs. As an extension of the standard flat top PLCC-4 SMT LEDs, the Power PLCC-4 with Lens device is able to provide focused beams within narrow viewing angles (50) meeting the market's requirements for focused radiation and high brightness in beam directions. The Power PLCC-4 SMT LED with 50 is ideal for panel, push button, general backlighting, automotive interior & exterior (cluster backlighting, side repeaters, brake lights), sign and symbol illumination, office equipment, industrial equipment and home appliances applications. This package design coupled with careful selection of component materials allow the Power PLCC-4 SMT LED with Lens to perform with higher reliability in a larger temperature range -40C to 100C. This high reliability feature is crucial to allow the Power PLCC-4 SMT LED with Lens to do well in harsh environments such as its target Automotive & ESS markets. The Power PLCC4 SMT LED with Lens package is also designed to be compatible with both IR-solder re-flow and throughthe-wave soldering.
Features
* Industry standard PLCC-4 * High reliability LED package * High brightness using AlInGaP dice technologies * High optical efficiency * Narrow Viewing angle at 50 * Available in 8mm carrier tape on 7-inch reel
Applications
* Interior automotive - Instrument panel backlighting - Central console backlighting - Cabin backlighting - Navigation and audio system - Dome lighting - Push button backlighting * Exterior automotive - Turn signals - CHMSL - Rear combination lamp - Side repeaters * Office automation, home appliances, industrial equipment - Front panel backlighting - Push button backlighting - Display backlighting
Package Drawing
Note: 1. All Dimensions in millimeters. 2. Terminal Finish: Ag plating 3. Electrical connection between all cathode is recommended
Figure 1. Package Drawing
Pin 1 2 3 4
HSMx-A46x Lead Configuration Cathode Anode Cathode Cathode
Table 1. Device Selection Guide
Luminous Intensity, FV [1] (mcd) Color Amber Amber Red Red Orange Part Number HSMA-A460-W50M1 HSMA-A461-X83M1 HSMC-A460-U30M1 HSMC-A461-V00M1 HSML-A461-W40M1 Min. Iv (mcd) 1125 2240 450 715 1125 Typ. Iv (mcd) 2100 3300 580 1750 1850 Max. Iv (mcd) 3550 5600 900 2850 Test Current (mA) 50 50 50 50 50 Dice Technology AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP
Notes: 1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. Tolerance = 12%
2
Part Numbering System
H S M x 1 - A x 2 x3 x4 - x5 x6 x7 x8 x9 Packaging Option Color Bin Selection Intensity Bin Selection Device Specific Configuration Package Type LED Chip Color
Table 2. Absolute Maximum Ratings (TA = 25 C)
Parameters DC Forward Current [1] Peak Forward Current [2] Power Dissipation Reverse Voltage Junction Temperature Operating Temperature Storage Temperature HSMA/C/L 70 mA 200 mA 180 mW 5V 110C -40 C to +100 C -40 C to +100 C
Notes: 1. Derate Linearly as shown in Figure 6. 2. Duty Factor = 10%, Frequency = 1kHz
Table 3. Optical Characteristics (TA = 25 C)
Peak Wavelength lPEAK (nm) Typ. 592 635 609 Dominant Wavelength lD [1] (nm) Typ. 590 626 605 Viewing Angle 2q1/2 [2] (Degrees) Typ. 50 50 50 Luminous Efficacy hV [3] (lm/W) Typ. 480 150 320 Luminous Efficiency he (lm/W) Typ. 22 19 23 Luminous Intensity/ Total Flux [4, 5] IV (cd) / FV (lm) Typ. 1.35 1.15 1.05
Color Amber Red Orange
Part Number HSMA-A46x HSMC-A46x HSML-A46x
Dice Technology AlInGaP AlInGaP AlInGaP
Notes: 1. The dominant wavelength, lD, is derived from the CIE Chromaticity diagram and represents the color of the device. 2. q1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / hV, where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens / watt. 4. FV is the total luminous flux output as measured with an integrating sphere after the device has stabilized. 5. Flux tested at mono pulse conditions.
Table 4. Electrical Characteristics (TA = 25 C)
Forward Voltage VF (Volts) @ IF = 50 mA Part Number HSMA-A46x HSMC-A46x HSML-A46x Typ. 2.20 2.20 2.20 Max. 2.50 2.50 2.50 Reverse Voltage VR @ 100mA Min. 5 5 5 Thermal Resistance RqJ-P (C/W) 110 110 110
3
1.0 0.9 0.8 RELATIVE INTENSITY 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 430 480 530 580 630 680 730 780 WAVELENGTH - nm AlInGaP Amber AlInGaP Red AlInGaP Orange
Figure 2. Relative Intensity Vs. Wavelength
80 70 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 50 mA) FORWARD CURRENT - mA 60 50 HSMA/C/L 40 30 20 10 0 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 0.5 1 1.5 2 2.5 FORWARD VOLTAGE - V HSMC/L HSMA
0
10
20
30
40
50
60
70
80
DC FORWARD CURRENT - mA
Figure 3. Forward Current Vs. Forward Voltage.
2.5
Figure 4. Relative Intensity Vs. Forward Current
NORMALIZED LUMINOUS INTENSITY
2 AlInGaP Amber 1.5 AlInGaP Orange AlInGaP Red
1
0.5
-50
-25
0
0
25 50 75 AMBIENT TEMPERATURE - C
100
125
Figure 5. Relative Intensity Vs. Temperature
4
80
80
MAXIMUM FORWARD CURRENT - mA
60 R JA= 350C/W 40 R JA= 470C/W 20
R JA = 300C/W
MAXIMUM FORWARD CURRENT - mA
120
60
40
20
0
0
20
40 60 80 AMBIENT TEMPERATURE - C
100
0
0
20
40 60 80 100 SOLDER POINT TEMPERATURE (C)
120
Figure 6a. Maximum Forward Current Vs. Ambient Temperature. Derated Based on TJMAX = 110C, RqJ-A= 300C/W, 350C/W and 470C/W.
Figure 6b. Maximum Forward Current Vs. Solder Point Temperature. Derated Based on TJMAX = 110C, RqJ-P = 110C/W.
630 625 DOMINANT WAVELENGTH - nm 620 615 610 605 600 595 590 585 0 10 20 AlInGaP Amber AlInGaP Orange AlInGaP Red
FORWARD VOLTAGE SHIFT - V
0.15 0.1 0.05 0 -0.05 -0.1 -0.15 JUNCTION TEMPERATURE - C
-50
-25
0
25
50
75
100
30 40 50 FORWARD CURRENT - mA
60
70
80
Figure 7. Dominant Wavelength Vs. Forward Current.
Figure 8. Forward Voltage Shift Vs. Temperature.
1 0.9 NORMALIZED INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90
Figure 9. Radiation Pattern
5
10 to 20 SEC. 217C 255 C +5C -0C
TEMPERATURE
-6C/SEC MAX.
3C/SEC MAX. 125C +/- 25C
60-150 SEC. MAX. 120 SEC. TIME
Figure 10. Recommended Pb-free Reflow Soldering Profile. Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components.
2.60 (0.103) 1.10 (0.043) 0.50 (0.020) 4.50 (0.178) 1.50 (0.059) Y X X 0.40 (0.016)
Y
Thermal Resistance 300C/W 350C/W
Solder pad area (xy) >16mm2 >12mm2 >8mm2
DIMENSIONS IN mm (INCHES).
SOLDER RESIST
REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS
470C/W
Figure 11a. Recommended Soldering Pad Patter
X 6.1 (0.240) 2.8 (0.110) Y 2.0 (0.079) X 0.5 (0.020)
6.0 (0.236) 3.0 (0.118) 2.0 (0.079) Y 1.0 (0.039)
DIMENSIONS IN mm (INCHES).
SOLDER RESIST
Figure 11b. Recommended Soldering Pad Patter (TTW)
REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS
6
Figure 12. Soft Tip Vacuum Pick-up Tool for extracting SMT LED Components from Carrier Tape.
TRAILER 200 mm MIN. FOR 180 REEL. 200 mm MIN. FOR 330 REEL.
COMPONENT
LEADER 480 mm MIN. FOR 180 REEL. 960 mm MIN. FOR 330 REEL.
C
A
USER FEED DIRECTION
Figure 13. Tape Leader and Trailer Dimensions.
Figure 14. Tape Dimensions.
7
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 15. Reeling Orientation.
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level xx per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel - For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - "10%" or "15%" HIC indicator turns pink. - The LEDs are exposed to condition of >30C / 60% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 605C for 20 hours.
8
Intensity Bin Select (X5X6)
Individual reel will contain parts from one half bin only
Color Bin Select (X7)
Individual reel will contain parts from one full bin only.
X5
X6 0 2 3 4 5 6 7 8 9
Min IV Bin
Full Distribution 2 half bins starting from X51 3 half bins starting from X51 4 half bins starting from X51 5 half bins starting from X51 2 half bins starting from X52 3 half bins starting from X52 4 half bins starting from X52 5 half bins starting from X52
X7
0 Z Y W V U Q P N M 1 3 Min. (mcd) 450.00 560.00 715.00 900.00 1125.00 1400.00 1800.00 2240.00 2850.00 3550.00 4500.00 5600.00 7150.00 9000.00 11250.00 14000.00 Max. (mcd) 560.00 715.00 900.00 1125.00 1400.00 1800.00 2240.00 2850.00 3550.00 4500.00 5600.00 7150.00 9000.00 11250.00 14000.00 18000.00 Orange A B C D E Red Full Distribution Min. (nm) 597.0 600.0 603.0 606.0 609.0 Min. (nm) 620.0 Max. (nm) 600.0 603.0 606.0 609.0 612.0 Max. (nm) 635.0 4 5 6 Full Distribution A and B only B and C only C and D only D and E only E and F only A, B and C only B, C and D only C, D and E only D, E and F only A, B, C and D only B, C, D and E only C, D, E and F only A, B, C, D and E only B, C, D, E, and F only
Intensity Bin Limits
Bin ID U1 U2 V1 V2 W1 W2 X1 X2 Y1 Y2 Z1 Z2 11 12 21 22
Color Bin Limits
Amber A B C D E F Min. (nm) 582.0 584.5 587.0 589.5 592.0 594.5 Max. (nm) 584.5 587.0 589.5 592.0 594.5 597.0
Tolerance of each bin limit = 12%
Tolerance of each bin limit = 1nm
Packaging Option (X8 X9)
Option M1 Test Current 50mA Package Type Top Mount Reel Size 7
VF Bin Limits
Bin ID VA VB VC VD VE Min. 1.9 2.2 2.5 2.8 3.1 Max. 2.2 2.5 2.8 3.1 3.4
Tolerance of each bin limit = 0.1V
For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 2007 Avago Technologies Limited. All rights reserved. AV02-0529EN - June 26, 2007

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